Vision. Value. VirTex.

Board Level Assembly (BLA)

Board Level Assembly

Products and parts are getting smaller and more efficient, which is maximizing the potential of today’s technology and the ability to develop more sophisticated boards.

This can be further enhanced by improvements made within the manufacturing process, which improves quality, reducec production time and, by extension, improves the playing field and position for many smaller developmental OEMs in the technology world.

Turn times

  • 2 week turn times
  • Scheduled deliveries

Parts Procurement

  • Turnkey
  • Kitted/Consigned
  • Partial Turnkey

Assembly Types

  • Surface Mount (SMT)
  • Thru-hole
  • Mixed Technology (SMT/Thru-hole)
  • Single or double sided placement

Solder Types

  • Leaded
  • Lead-free/RoHS compliant
  • No-clean process available

Other Capabilities

  • Repair/Rework services
  • Mechanical Assembly
  • Box Build/Electromechanical Assembly
  • Sub-assemblies

Component Types
Passive Components

  • As small as 0402 package
  • As small as 0201 with design review
  • Ball Grid Arrays (BGA)
  • As small as .4mm pitch
  • All BGA placements are x-ray inspected

Fine Pitch Components

  • As small as 15 mil pitch